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Toshiba Ups Ante in 3D NAND Fray

Gary Hilson, EETimes
3/31/2015 03:37 PM EDT

The transition to 3D NAND is picking up speed as Toshiba announced in late March it was shipping samples of its 48-layer 3D Bit Cost Scalable (BiCS) stacked cell structure flash

http://www.eetimes.com/document.asp?doc_id=1326180



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