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YMTC Announces Xtacking 3.0 for Faster, Denser 3D TLC NAND

Francisco Pires | Tom's Hardware Aug 03, 2022

Chinese NAND increases competitiveness at 2,400 MT/s, up to 1 Tb density in a single chip.

China-based Yangtze Memory Technologies (YMTC) has announced the latest iteration of its Xtacking NAND technology (now in its third generation), ushering in a new era of speed, density, and improved power efficiency.

"The advent of YMTC's self-developed Silicon Stack 3.0 architecture is an important breakthrough in the 3D NAND track," said Gregory Wong, founder and chief analyst of Forward Insights. "It has been proven that the hybrid bonding of storage arrays and peripheral logic circuits is essential to drive the development and innovation of 3D NAND technology."

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