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Memory Chip Makers Take 3D NAND Up a Level
Electronic Design | James Morra Aug. 10, 2022
Micron and SK Hynix are turning up the pressure on each other with 3D NAND chips made up of more than 230 layers.
Memory chip giants are upping the ante on each other with new generations of 3D NAND flash technology.
"The advancement of 3D NAND technology is crucial for innovation in the memory market," said Gregory Wong, founder and principal analyst at Forward Insights.
The world's No. 3 memory chip supplier, Micron currently leads when it comes to mass production of 3D NAND with more than 200 layers. But the competition sits close behind.
https://www.electronicdesign.com/technologies/embedded-revolution/article/21248389/electronic-design-memory-chip-makers-take-3d-nand-up-a-level
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