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SanDisk, Toshiba to devise 3D chips
Mark LaPedus, EETimes, Jun 17, 2008
Gregory Wong, president of Forward Insights, a consulting and market
research company, said there are many challenges for this 3D
technology.
''A four-level 3D R/W memory will have to at least
catch up with NAND flash on process technology to be
considered competitive with x4 NAND flash,'' Wong said, referring to
NAND-based four-bit-per-cell technology.
''This would put 3D R/W memory at least 3-4 years out,'' Wong said.
''The other issue is whether an eight level stack is
manufacturable at high yields. An eight-level stack was demonstrated
by Matrix in 2003 on a much less advanced 0.25-um geometry.
Producing eight level memory stacks at leading edge
technology is another matter.''
http://www.eetimes.com/news/semi/showArticle.jhtml?articleID=208700256
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